This inventor holds 3 USPTO granted patents. Top assignee: Motorola Corporation. Active years: 1997-1998.
Location History:
- Chandler, AZ (US) (1997 - 1998)
- Mesa, AZ (US) (1998)
Company Filing History:
Years Active: 1997-1998
Title: The Innovative Contributions of Patrick F. Thompson
Introduction
Patrick F. Thompson is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work has been instrumental in advancing the efficiency and effectiveness of integrated circuit assemblies.
Latest Patents
Thompson's latest patents include a semiconductor wafer contact system and a method for contacting a semiconductor wafer. This innovative system features a sealed bladder that contains incompressible material, which presses against a flexible circuit layer. The bladder adapts in shape to accommodate irregularities in contact height and non-parallelism, ensuring a constant force between the membrane contacts and die contacts across the entire wafer. Another significant patent involves an integrated circuit assembly with a stepped interposer, which includes a central portion with multiple contact regions and a peripheral region with bonding regions. This design provides added protection for wirebonds and enhances the overall reliability of the integrated circuit assembly.
Career Highlights
Patrick F. Thompson is currently employed at Motorola Corporation, where he continues to innovate and develop new technologies. His expertise in semiconductor systems has positioned him as a key player in the industry.
Collaborations
Thompson has collaborated with notable coworkers, including William M. Williams and Scott E. Lindsey, contributing to various projects that have furthered advancements in semiconductor technology.
Conclusion
Patrick F. Thompson's contributions to the field of semiconductor technology through his patents and work at Motorola Corporation highlight his role as an influential inventor. His innovative designs continue to shape the future of integrated circuit assemblies.