Rockville, MD, United States of America

Patrick Baier

This inventor holds 1 USPTO granted patent. Top assignee: Siemens Industry Software Gmbh. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Patrick Baier. Retrieved from https://idiyas.com/inventor/patrick-baier

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: The Innovative Mind of Patrick Baier

Introduction

Patrick Baier is a notable inventor based in Rockville, MD (US). He has made significant contributions to the field of parametric curve modeling. His innovative approach has led to the development of a unique patent that addresses complex challenges in this area.

Latest Patents

Patrick Baier holds a patent for a "Modelling method and system." This method involves deriving an offset profile of a parametric curve by generating an offset parametric curve based on user input. The process ensures that if no self-intersections are present in the created spline approximation, the offset parametric curve is output as the final result. However, if self-intersections are detected, the spline curve is modified to eliminate these intersections, ensuring a clean and accurate output.

Career Highlights

Patrick Baier is currently employed at Siemens Industry Software GmbH, where he continues to innovate and develop new solutions. His work focuses on enhancing modeling techniques and improving the efficiency of parametric curve representations. With a patent portfolio that includes 1 patent, he has established himself as a valuable asset in his field.

Collaborations

One of Patrick's notable coworkers is Hugh Bradley. Their collaboration has likely contributed to the advancements in their projects and the overall success of their initiatives at Siemens.

Conclusion

Patrick Baier's contributions to the field of parametric curve modeling exemplify the spirit of innovation. His patent and work at Siemens Industry Software GmbH highlight his commitment to advancing technology and solving complex problems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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