This inventor holds 1 USPTO granted patent. Top assignee: Thomson-Csf. Active years: 2003.
Company Filing History:
Years Active: 2003
Title: The Innovative Contributions of Pascal Etourneau
Introduction
Pascal Etourneau is a notable inventor based in Cholet, France. He has made significant contributions to the field of microwave technology, particularly in the area of surface mounting techniques. His work has implications for the efficiency and effectiveness of microwave packages in electronic applications.
Latest Patents
Pascal Etourneau holds a patent for a "Method for surface mounting of a microwave package on a printed circuit and package and printed circuit for implementing said method." This innovative method involves the precise positioning of a backset microwave package against a printed circuit. The connections are established by soldering the conducting elements in direct contact. A unique feature of this invention is the use of a cage that encloses a chip, replacing the conventional cover. This cage is formed by layouts on both the package and the printed circuit, linked together by metal connections. The surface mounting technique is particularly applicable to packages operating in millimetric microwaves, enhancing their performance.
Career Highlights
Pascal Etourneau has been associated with Thomson-CSF, a prominent company in the electronics sector. His work there has focused on advancing microwave technology and improving the methods used in electronic packaging. His innovative approach has led to the development of more efficient and reliable microwave packages.
Collaborations
Throughout his career, Pascal has collaborated with esteemed colleagues such as Gérard Cachier and Vincent Jahier. These collaborations have fostered a creative environment that has contributed to the advancement of microwave technology.
Conclusion
Pascal Etourneau's contributions to microwave technology through his innovative patent and work at Thomson-CSF highlight his role as a significant inventor in the field. His advancements in surface mounting techniques are paving the way for future developments in electronic applications.