The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2003

Filed:

May. 26, 2000
Applicant:
Inventors:

Jean-Yves Daden, Bois Colombes, FR;

Muriel Gohn-Devineau, Chatou, FR;

Gérard Cachier, Bures sur Yvette, FR;

Pascal Etourneau, Cholet, FR;

Vincent Jahier, St Leu la Foret, FR;

Alain Grancher, Vemars, FR;

Ludovic Michel, Plaisir, FR;

Assignee:

Thomson-CSF, Paris, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/02 ;
U.S. Cl.
CPC ...
H05K 7/02 ;
Abstract

The surface mounting of a backset microwave package on a printed circuit. After the package has been accurately positioned against the printed circuit the connections are produced by soldering the conducting elements in direct contact. A chip is enclosed in a sort of cage constituting a screen which replaces a conventional cover, the cage is formed by layouts borne respectively by the package and the printed circuit and is linked together by metal links. The surface mounting is particularly applicable to packages operating in millimetric microwaves.


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