This inventor holds 1 USPTO granted patent. Top assignee: Thomson-Csf. Active years: 2003.
Company Filing History:
Years Active: 2003
Title: Muriel Gohn-Devineau: Innovator in Microwave Packaging Technology
Introduction
Muriel Gohn-Devineau is a notable inventor based in Chatou, France. She has made significant contributions to the field of microwave packaging technology. Her innovative approach has led to the development of a unique method for surface mounting microwave packages on printed circuits.
Latest Patents
Muriel holds a patent for a method titled "Method for surface mounting of a microwave package on a printed circuit and package and printed circuit for implementing said method." This invention focuses on the surface mounting of a backset microwave package on a printed circuit. The process involves accurately positioning the package against the printed circuit, followed by soldering the conducting elements in direct contact. A chip is enclosed in a cage that serves as a screen, replacing a conventional cover. This cage is formed by layouts on both the package and the printed circuit, linked together by metal connections. The surface mounting technique is particularly applicable to packages operating in millimetric microwaves. She has 1 patent to her name.
Career Highlights
Muriel Gohn-Devineau has worked at Thomson-CSF, a prominent company in the field of electronics and telecommunications. Her work has been instrumental in advancing microwave technology, showcasing her expertise and innovative spirit.
Collaborations
Throughout her career, Muriel has collaborated with notable colleagues, including Pascal Etourneau and Alain Grancher. These partnerships have contributed to her success and the development of her groundbreaking inventions.
Conclusion
Muriel Gohn-Devineau is a pioneering inventor whose work in microwave packaging technology has made a lasting impact. Her innovative methods and collaborations highlight her significant contributions to the field.