Boise, ID, United States of America

Paolo Tessariol

This inventor holds 1 USPTO granted patent. Top assignee: Micron Technology Incorporated. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Paolo Tessariol. Retrieved from https://idiyas.com/inventor/paolo-tessariol-2z21f5kd

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: The Innovations of Paolo Tessariol

Introduction

Paolo Tessariol is an accomplished inventor based in Boise, ID (US). He is known for his contributions to the field of memory technology, particularly through his innovative patent work. With a focus on enhancing memory arrays, Tessariol has made significant strides in the industry.

Latest Patents

Tessariol holds a patent titled "Memory Array Having Air Gaps." This invention aims to improve the efficiency and performance of memory arrays, showcasing his expertise in semiconductor technology. He has 1 patent to his name, reflecting his commitment to advancing technological solutions.

Career Highlights

Currently, Paolo Tessariol is employed at Micron Technology Incorporated, a leading company in the semiconductor industry. His role at Micron allows him to work on cutting-edge technologies that shape the future of memory solutions. His contributions have been instrumental in driving innovation within the company.

Collaborations

Tessariol collaborates with fellow inventor Enrico Varesi, further enhancing the creative synergy within their projects. Their partnership exemplifies the collaborative spirit that is essential in the field of technology and innovation.

Conclusion

Paolo Tessariol's work in memory technology, particularly through his patent on memory arrays, highlights his role as a significant inventor in the industry. His contributions at Micron Technology Incorporated and collaborations with other inventors continue to push the boundaries of innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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