Santa Fe Springs, CA, United States of America

Paola V Lopez

This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Raytheon Company. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Paola V Lopez. Retrieved from https://idiyas.com/inventor/paola-v-lopez

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Paola V. Lopez and a Protective Enclosure for Electronic Components.

Introduction

Paola V. Lopez is an inventor associated with Santa Fe Springs, California, and Raytheon Company. Her patent work addresses protection of electronic components from foreign object debris while helping secure thermal interface material.

Latest Patents

Lopez is credited with 1 patent: “Structural Enclosure for Protection Against Foreign Object Debris and Restraint of Thermal Interface Material.” The invention describes a system with an electrical component mounted on a substrate and surrounded by a structural enclosure. Raised walls around the component are designed to block foreign object debris. A lid covers the component and enclosure, while a seal between the enclosure and lid compresses when the lid is attached to the substrate. Thermal interface material sits between and contacts the electrical component and the lid.

Career Highlights

Lopez’s listed patent reflects work on enclosure design that combines debris protection with the restraint of thermal interface material. Her company affiliation is Raytheon Company.

Collaborations

Charles Chu and Bruce Vinttran are identified as Lopez’s coworkers. The available information does not specify their roles in the patent or whether they collaborated on the invention.

Conclusion

Paola V. Lopez’s patent describes an enclosure that protects an electronic component from debris while incorporating a seal and thermal interface material into the assembly.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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