The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

Dec. 05, 2023
Applicant:

Raytheon Company, Tewksbury, MA (US);

Inventors:

Charles Chu, Temple City, CA (US);

Bruce Vinttran, San Pedro, CA (US);

Paola V. Lopez, Santa Fe Springs, CA (US);

Sung H. Lee, Santa Clarita, CA (US);

Keith R. Burrell, Rancho Palos Verdes, CA (US);

Andrew J. Bristol, Brentwood, CA (US);

Kevin A. Miyamoto, Camarillo, CA (US);

Assignee:

Raytheon Company, Arlington, VA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2026.01); H05K 1/182 (2026.01); H05K 13/04 (2006.01);
U.S. Cl.
CPC ...
H05K 1/182 (2013.01); H05K 1/0201 (2013.01); H05K 13/04 (2013.01); H05K 2201/062 (2013.01); H05K 2201/0999 (2013.01);
Abstract

A system includes a substrate and an electrical component mounted to the substrate. The system also includes a structural enclosure positioned around lateral edges of the electrical component and mounted to the substrate. The structural enclosure includes raised walls extending away from the substrate and surrounding the electrical component. The raised walls are configured to block foreign object debris from the electrical component. The system further includes a lid connected to the substrate, where the lid covers the electrical component and the structural enclosure. The system also includes a seal positioned between the structural enclosure and the lid, where the seal is configured to be compressed when the lid is connected to the substrate. In addition, the system includes a thermal interface material positioned between and contacting the electrical component and the lid.


Find Patent Forward Citations

Chu, Charles. (2026). Structural enclosure for protection against foreign object debris and restraint of thermal interface material (U.S. Patent No. 12739978). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12739978

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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