San Pedro, CA, United States of America

Bruce Vinttran

This inventor holds 1 USPTO granted patent. Top assignee: Raytheon Company. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bruce Vinttran. Retrieved from https://idiyas.com/inventor/bruce-vinttran

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Bruce Vinttran and a Protective Enclosure for Electronic Components.

Introduction

Bruce Vinttran is an inventor associated with San Pedro, California, and Raytheon Company. His patent work addresses the protection and thermal management of electronic components.

Latest Patents

Vinttran is credited with 1 patent: “Structural Enclosure for Protection Against Foreign Object Debris and Restraint of Thermal Interface Material.” The invention describes a substrate with an electrical component mounted on it, surrounded by a structural enclosure with raised walls designed to block foreign object debris. A lid covers the component and enclosure, while a seal between the enclosure and lid compresses when the lid is attached to the substrate. Thermal interface material sits between and contacts the electrical component and the lid.

Career Highlights

The available information identifies Vinttran’s work with Raytheon Company and highlights his patent on an enclosure that combines debris protection with thermal interface material restraint.

Collaborations

Charles Chu and Paola V. Lopez are identified as Vinttran’s coworkers. The provided information does not specify their roles in the patent or any particular collaboration.

Conclusion

Bruce Vinttran’s patent presents a structural approach to protecting electronic components from foreign object debris while accommodating thermal interface material within the assembly.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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