Pao-Kun Liao

Title: Pao-Kun Liao: Innovator in Semiconductor Cooling Technology

Introduction

Pao-Kun Liao is a notable inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of cooling devices for wafer machines. His innovative approach has led to the development of a unique cooling device that enhances the efficiency of semiconductor manufacturing processes.

Latest Patents

Liao holds a patent for a "Cooling device for wafer machine." This device is designed to rapidly cool a semiconductor wafer test or transfer machine. It features a body with an interior gas passage, one end of which connects to a source of clean, dry air or other gas. In typical applications, the device is positioned on the cover of a semiconductor wafer test or transfer machine, adjacent to the chuck or wafer holder. The air or gas flowing through the passage impinges against the machine cover, effectively cooling the chuck or wafer holder.

Career Highlights

Pao-Kun Liao has established himself as a key figure in the semiconductor industry. His work at Taiwan Semiconductor Manufacturing Company Limited has allowed him to collaborate with leading experts in the field. His innovative cooling device is a testament to his commitment to improving semiconductor manufacturing processes.

Collaborations

Liao has worked closely with his coworker, Wen-Tsai Su, to advance their projects and share insights in semiconductor technology. Their collaboration has contributed to the development of effective solutions in the industry.

Conclusion

Pao-Kun Liao's contributions to semiconductor cooling technology exemplify the importance of innovation in the field. His patent for a cooling device demonstrates his ability to address critical challenges in semiconductor manufacturing. Liao's work continues to influence the industry and pave the way for future advancements.