The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2004
Filed:
Apr. 25, 2002
Applicant:
Inventors:
Pao-Kun Liao, Hsin-Chu, TW;
Wen-Tsai Su, Miali, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co. Ltd, Hsin Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F26B 2/106 ;
U.S. Cl.
CPC ...
F26B 2/106 ;
Abstract
A device for rapidly cooling a semiconductor wafer test/transfer machine and which includes a body which is provided with an interior gas passage one end of which is connected to a source of clean, dry air or other gas by a tubing. In typical application, the body is rested on the cover of a semiconductor wafer test or transfer machine, typically above or adjacent to the chuck or other wafer holder of the machine, with the other end of the gas passage in contact with the cover. The air or gas flowing through the gas passage impinges against the machine cover and rapidly cools the chuck or other wafer holder.