Pang-Sheng Chang

Title: Innovator Pang-Sheng Chang: Pioneering Advances in Semiconductor Technology

Introduction: Pang-Sheng Chang, an accomplished inventor based in Hsinchu, Taiwan, has made significant contributions to the field of semiconductor technology. With a total of three patents to his name, Chang is recognized for innovative methods that enhance semiconductor device manufacturing processes.

Latest Patents: Among his latest inventions is a patented method for polishing interconnect structures in semiconductor devices. This ingenious method involves forming a first conductive feature over a semiconductor substrate, followed by creating an interlayer dielectric (ILD) layer. Chang’s method also includes intricate processes such as patterning the ILD layer to create a trench, filling it with a conductive layer, and polishing the conductive layer to establish a via contact. This innovation not only interconnects two conductive features but also ensures a clean and efficient manufacturing process.

Career Highlights: Pang-Sheng Chang is currently associated with Taiwan Semiconductor Manufacturing Company Ltd., where he leverages his expertise to drive forward advancements in semiconductor fabrication techniques. His work in this esteemed company underscores his role in shaping the future of electronic devices.

Collaborations: Throughout his career, Chang has collaborated with talented colleagues, including Kuo-Yi Chao and Fu-Kai Yang. Their combined efforts push the boundaries of what is possible in semiconductor technology, demonstrating the power of teamwork in innovation.

Conclusion: Pang-Sheng Chang’s innovative spirit and technical prowess make him a notable figure in the realm of semiconductor inventions. His work not only exemplifies the importance of patents in promoting technological advancements but also highlights his commitment to pioneering methods that enhance the efficiency and efficacy of semiconductor devices.