This inventor holds 1 USPTO granted patent. Top assignee: Asmpt Singapore Pte. Ltd.. Active years: 2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2023
Title: The Innovations of Pak Kin Leung
Introduction
Pak Kin Leung is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of semiconductor technology. His work primarily focuses on enhancing the efficiency and effectiveness of die bonding processes.
Latest Patents
Pak Kin Leung holds a patent for a "Die bond head apparatus with die holder motion table." This innovative apparatus features a die bond head body that is coupled to a die bond head motion table. It also includes a die holder motion table mounted on the die bond head body, which allows for the secure placement of a semiconductor die onto a substrate. The design enables the die holder to be positioned independently of the die bond head motion table, enhancing operational flexibility.
Career Highlights
Pak Kin Leung is currently employed at Asmpt Singapore Pte. Ltd., where he continues to develop cutting-edge technologies in the semiconductor industry. His expertise and innovative mindset have made him a valuable asset to his team.
Collaborations
Pak Kin Leung has collaborated with various professionals in his field, including his coworker Chung Sheung Yung. Their combined efforts contribute to the advancement of semiconductor technologies.
Conclusion
Pak Kin Leung's contributions to the semiconductor industry through his innovative patent and collaborative efforts highlight his role as a significant inventor. His work continues to influence the field positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile