This inventor holds 1 USPTO granted patent. Top assignee: Advanced Micro Devices Corporation. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Otto Joe - Innovator in Thermal Interface Material Management
Introduction
Otto Joe is a notable inventor based in Santa Clara, CA (US). He has made significant contributions to the field of integrated circuit packaging, particularly in managing thermal interface materials.
Latest Patents
Otto Joe holds a patent for a "Package assembly with thermal interface material gutter." This invention provides a method and apparatus that effectively manages the movement of thermal interface material (TIM) that is squeezed out from between a lid and an integrated circuit (IC) die of a chip package. The design includes a chip package with an IC die mounted on a substrate and covered by a lid. The bottom surface of the lid features a die overlapped region facing the top surface of the IC die, along with a first gutter formed to receive TIM that is squeezed out.
Career Highlights
Otto Joe is currently employed at Advanced Micro Devices Corporation, a leading company in the semiconductor industry. His work focuses on enhancing the efficiency and reliability of chip packaging through innovative designs.
Collaborations
Otto collaborates with Michael Flynn, a fellow innovator in the field. Their combined expertise contributes to advancements in thermal management solutions for integrated circuits.
Conclusion
Otto Joe's innovative work in thermal interface material management showcases his commitment to improving integrated circuit packaging. His contributions are vital to the ongoing development of efficient semiconductor technologies.