The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2026
Filed:
Jan. 22, 2023
Advanced Micro Devices, Inc., Santa Clara, CA (US);
Michael Flynn, Santa Clara, CA (US);
Otto Joe, Santa Clara, CA (US);
Advanced Micro Devices, Inc., Santa Clara, CA (US);
Abstract
A method and apparatus are provided which manages the movement of thermal interface material (TIM) squeezed out from between a lid and an IC die of an IC (chip) package. In one embodiment, a chip package is provided that includes an IC die mounted on a substrate and covered by a lid. A bottom surface of the lid has a die overlapped region facing a top surface of the IC die. The bottom surface of the lid has a first gutter formed therein. An outer sidewall of the first gutter is formed outward of the first die overlapped region as to receive TIM squeezed out from between a lid and an IC die.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile