Michael Flynn

Title: Michael Flynn - Innovator in Thermal Interface Technology

Introduction

Michael Flynn is a notable inventor based in Santa Clara, CA (US). He has made significant contributions to the field of thermal interface materials, particularly in the design and functionality of integrated circuit (IC) packages. His innovative approach has led to the development of a patented technology that enhances the performance and reliability of electronic devices.

Latest Patents

Michael Flynn holds a patent for a "Package assembly with thermal interface material gutter." This invention provides a method and apparatus that effectively manages the movement of thermal interface material (TIM) that is squeezed out from between a lid and an IC die of an IC package. The patent describes a chip package that includes an IC die mounted on a substrate and covered by a lid. The design features a bottom surface of the lid with a die overlapped region facing the top surface of the IC die, along with a first gutter formed to receive TIM squeezed out from between the lid and the IC die. This innovative solution addresses thermal management challenges in electronic packaging.

Career Highlights

Michael Flynn is currently employed at Advanced Micro Devices Corporation, a leading company in the semiconductor industry. His work at AMD focuses on improving thermal management solutions for high-performance computing applications. With his expertise, he has contributed to the advancement of technologies that are critical for modern electronic devices.

Collaborations

Michael Flynn collaborates with various professionals in the field, including his coworker Otto Joe. Together, they work on innovative projects that aim to enhance the efficiency and effectiveness of thermal interface materials in electronic packaging.

Conclusion

Michael Flynn's contributions to thermal interface technology exemplify the importance of innovation in the semiconductor industry. His patented solutions not only improve the performance of electronic devices but also pave the way for future advancements in thermal management.