Osamu Ohashi

Title: Osamu Ohashi: Innovator in Bonding Technologies

Introduction

Osamu Ohashi is a notable inventor based in Niigata, Japan. He has made significant contributions to the field of bonding technologies, holding a total of 2 patents. His innovative approaches have advanced the methods used in connecting materials, particularly aluminum alloys.

Latest Patents

Ohashi's latest patents include a bonding method and apparatus that utilizes a nitrogen gas atmosphere to facilitate diffusion bonding. This apparatus features a nitrogen gas tank, a rotary pump, and a mechanical booster pump connected to a bonding vessel. A pressure sensor is included to maintain a predetermined pressure between 3-10Pa during the bonding process. The method involves bringing two electrodes into proximity to bond objects while applying current through them.

Another significant patent is a method of connecting aluminum alloy die cast members. This method allows for the connection of multiple aluminum alloys while preserving their molded shape. An intermediate material, either in plate or powder form, is intercalated between the connecting surfaces. The surfaces are designed to enhance electric resistance, allowing for effective bonding through the application of electric current.

Career Highlights

Throughout his career, Osamu Ohashi has worked with prominent companies such as SMC Corporation. His experience in these organizations has contributed to his expertise in bonding technologies and innovation.

Collaborations

Ohashi has collaborated with notable coworkers, including Keiichi Minegishi and Yasunori Yoshida. Their collective efforts have furthered advancements in the field of bonding methods.

Conclusion

Osamu Ohashi's contributions to bonding technologies through his patents and collaborations highlight his role as an influential inventor. His innovative methods continue to impact the industry positively.