Smc Corporation

Smc Kabushiki Kaisha

Osamu Ohashi

Keiichi Minegishi

Yasunori Yoshida

Kouji Wada

Koji Wada

A nitrogen gas tank, a rotary pump and a mechanical booster pump are connected to a bonding vessel that constitutes a bonding apparatus for carrying out diffusion bonding, the apparatus further comprising a pressure sensor. A nitrogen gas atmosphere is formed inside the bonding vessel, and under control operations of a control circuit, a nitrogen introduction rate is controlled so that a pressure is substantially fixed at a predetermined pressure between 3-10Pa. At such a state, under the action of a rod of a hydraulic cylinder, a second electrode is brought into proximity with a first electrode, so that ultimately, a first object to be bonded and a second object to be bonded on the first electrode are pressed. Further, current is applied through the first electrode and the second electrode with respect to the first object to be bonded and the second object to be bonded.

Bonding method and apparatus therefor

A method of connecting a plurality of aluminum alloys molded as a die cast member while maintaining the molded shape of the alloy is provided. An intermediate material in the form of plate or powder made of aluminum alloy is allowed to intercalate between mutually connecting surfaces of die cast members, the die cast member and/or intermediate material is constituted of an aluminum alloy, at least one of mutually contacting surfaces of the connecting surfaces and the intermediate material is constituted of a rough surface to enhance electric resistance between the contacting surfaces and the connecting surfaces are connected by applying electric current through the connecting surfaces.

Growing community of inventors

Niigata, Japan

Osamu Ohashi