This inventor holds 2 USPTO granted patents. Top assignees: Ohashi Technica, Inc., Tk Co., Ltd.. Active years: 2008-2015.
Location History:
- Tokyo, JP (2008)
- Aichi, JP (2015)
Company Filing History:
2 out of 7 
1 out of 4 Years Active: 2008-2015
Title: Osamu Kimpara: Innovator in Joining Technologies
Introduction
Osamu Kimpara is a notable inventor based in Aichi, Japan. He has made significant contributions to the field of joining technologies, holding 2 patents that showcase his innovative approaches. His work focuses on methods that enhance the strength and efficiency of metal joining processes.
Latest Patents
Kimpara's latest patents include a "Method of joining part having high fatigue strength" and a "Press-fit joint structure." The first patent describes a method that utilizes a supporting electrode with a cooling circuit and a pressure electrode to achieve solid-phase diffusion joining. This method involves using a steel material that undergoes martensitic transformation, allowing for a robust connection between two members. The process includes rapid cooling to generate compressive residual stress, enhancing the joint's durability.
The second patent, the "Press-fit joint structure," outlines a forced-insertion welded structure that is cost-effective and easy to manufacture. This structure consists of a first member with a hole that matches the cross-section of a second member, which is forcibly inserted under pressure while an electric current generates heat at the joint interface. This innovative approach results in a solid-state welded joint with high bonding strength.
Career Highlights
Throughout his career, Osamu Kimpara has worked with several companies, including Ohashi Technica, Inc. and Tk Co., Ltd. His experience in these organizations has contributed to his expertise in joining technologies and has allowed him to develop his patented methods.
Collaborations
Kimpara has collaborated with notable individuals in his field, including Akira Nozue and Masayuki Mizutani. These collaborations have likely enriched his work and contributed to the advancements in joining technologies.
Conclusion
Osamu Kimpara's innovative contributions to joining technologies have established him as a significant figure in the field. His patents reflect a commitment to enhancing the strength and efficiency of metal joining processes, making a lasting impact on the industry.