The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2015

Filed:

Jun. 29, 2011
Applicants:

Akira Nozue, Tokyo, JP;

Osamu Kimpara, Aichi, JP;

Inventors:

Akira Nozue, Tokyo, JP;

Osamu Kimpara, Aichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/00 (2006.01); B23K 20/02 (2006.01); B23K 11/00 (2006.01); B23K 20/00 (2006.01); B23P 11/02 (2006.01);
U.S. Cl.
CPC ...
B23K 31/00 (2013.01); B23K 20/021 (2013.01); B23K 20/028 (2013.01); B23K 2201/006 (2013.01); B23P 11/02 (2013.01); B23K 20/008 (2013.01); B23K 11/002 (2013.01);
Abstract

A method of joining using a supporting electrodehaving a cooling circuit and a pressure electrodemovably arranged above the supporting electrode, using a steel material causing martensitic transformation for one of or both of a first memberhaving an opening portion and a second member, engaging the second member with the opening portion of the first member, starting conduction from a power supply to the supporting electrode and the pressure electrode, allowing an insertion portion of the second member to enter the opening portion of the first member by a pressure force of the pressure electrode, causing the second member and an inner wall portion of the opening portion to be subjected to solid-phase diffusion joining, rapidly cooling the both members by thermal conduction of the supporting electrode after the joining, and quenching a joined portion and generating compressive residual stress by the rapid cooling.


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