Shimodate, Japan

Osamu Horie


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 1993-1996

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2 patents (USPTO):

Title: **Inventor Osamu Horie: Innovations in Semiconductor Technology**

Introduction

Osamu Horie, a notable inventor from Shimodate, Japan, has made significant contributions to the field of semiconductor technology. With two patents to his name, Horie has focused on developing advanced materials that improve the reliability and efficiency of electronic devices.

Latest Patents

Horie's latest patents showcase his dedication to innovation in semiconductor applications. The first is a **Resin-encapsulated semiconductor device**, designed to prevent blisters or cracks during soldering. This device is notable for its suitability for continuous production and excellent moisture resistance, achieved through a specially formulated epoxy resin encapsulating material. The second patent pertains to a **Plastic molded type electronic device**. This invention utilizes a purified resol-type phenol resin that meets strict conductivity and halogen ion content standards. The resulting composition exhibits excellent moldability and adhesive properties, making it ideal for resin-sealing electronic and semiconductor devices, as well as for transfer-molding applications.

Career Highlights

Throughout his career, Osamu Horie has worked with leading companies in the industry, including Hitachi, Ltd. and Hitachi Chemical Company, Ltd. His experiences at these organizations have undoubtedly shaped his innovative approach and his commitment to excellence in semiconductor technology.

Collaborations

Horie has collaborated with various talented professionals in his field, including Masatsugu Ogata and Yasuhide Sugawara. These collaborations have played a crucial role in advancing his research and patent endeavors, reflecting the importance of teamwork in driving innovation.

Conclusion

Osamu Horie stands out as a prominent inventor whose contributions to the semiconductor industry will resonate for years to come. His work, encapsulated in his patents, exemplifies the fusion of materials science and engineering, paving the way for future advancements in electronic devices.

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