The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 1996
Filed:
Aug. 07, 1995
Applicant:
Inventors:
Tatsuo Kawata, Shimodate, JP;
Hiroshi Suzuki, Hitachi, JP;
Hiroki Sashima, Shimodate, JP;
Kazuhiko Miyabayashi, Shimodate, JP;
Osamu Horie, Shimodate, JP;
Assignee:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257788 ; 257793 ; 257795 ;
Abstract
A resin-encapsulated semiconductor which is free from the occurrence of blisters or cracks during soldering, suits for continuous production and has excellent moisture resistance reliability is obtained by using an epoxy resin encapsulating material which comprises
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Kawata, Tatsuo. (1996). Resin-encapsulated semiconductor device (U.S. Patent No. 5567990). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5567990
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile