Hitachi, Ltd.

Hitachi Chemical Company, Ltd.

Osamu Horie

Masatsugu Ogata

Masanori Segawa

Hiroshi Suzuki

Hidetoshi Abe

Tatsuo Kawata

Hiroki Sashima

Yasuhide Sugawara

Kazuhiko Miyabayashi

A resin-encapsulated semiconductor which is free from the occurrence of blisters or cracks during soldering, suits for continuous production and has excellent moisture resistance reliability is obtained by using an epoxy resin encapsulating material which comprises

Resin-encapsulated semiconductor device

The phenol resin molding composition used in the present invention is obtained by subjecting a resol-type phenol resin to purification until, when the resin is extracted by heating with 10 times the amount of hot water at 120.degree. C. for 100 hours or more, the extract has an electric conductivity of 100 .mu.S/cm or less, a pH of 4-7 and a halogen ion content of 10 ppm or less, then preparing a composition comprising a resin component consisting of said resol-type phenol resin and a cure rate controlling agent incorporated therewith, optionally incorporating a filler into said composition, kneading the resulting mixture, and then grinding the kneaded mixture. The composition has a good moldability and, when used for resin-sealing of electronic devices or semiconductor devices and transfer-molding of electronic devices using resin, exhibits an excellent adhesive property, electric properties, moisture resistance and heat resistance.

Plastic molded type electronic device

Growing community of inventors

Shimodate, Japan

Osamu Horie