Location History:
- Ottobrunn, DE (2002)
- Taufkirchen, DE (2005 - 2022)
Company Filing History:
Years Active: 2002-2025
Title: The Innovative Contributions of Ordwin Haase
Introduction
Ordwin Haase is a notable inventor based in Taufkirchen, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of 9 patents. His work focuses on enhancing the efficiency and performance of semiconductor packages, which are crucial components in modern electronic devices.
Latest Patents
Among his latest innovations, Haase has developed the "Double-sided coolable semiconductor package." This invention features an encapsulant body, a first electrically conductive element with an outwardly exposed metal surface, and a first carrier substrate that includes multiple conductive layers and an electrical insulation layer. The design incorporates a power semiconductor chip and conductive spacers to optimize thermal management and electrical performance. Another significant patent is the "Double sided semiconductor package," which similarly includes an encapsulant body and conductive elements, but emphasizes a dual-layer structure for improved functionality and connectivity.
Career Highlights
Ordwin Haase is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His role involves pioneering advancements in semiconductor packaging technology, which are essential for the development of efficient electronic systems. His innovative designs have contributed to the company's reputation for excellence in the semiconductor industry.
Collaborations
Haase has collaborated with esteemed colleagues such as Juergen Hoegerl and Tobias Kist. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion
Ordwin Haase's contributions to semiconductor technology exemplify the spirit of innovation. His patents not only enhance the performance of electronic devices but also reflect his commitment to advancing the field. His work at Infineon Technologies AG continues to influence the future of semiconductor design and application.