This inventor holds 2 USPTO granted patents and 4 published patent applications. Top assignee: Stmicroelectronics (Grenoble 2) Sas. Active years: 2021-2024.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2021-2024
Title: Olivier Franiatte: Innovator in Integrated Circuit Packaging
Introduction
Olivier Franiatte, a talented inventor based in Grenoble, France, has made significant contributions to the field of integrated circuit packaging. With a focus on innovation, he holds two patents that showcase his expertise in designing effective solutions for semiconductor technology.
Latest Patents
Franiatte's latest patents include a novel cap for the package of integrated circuits. This design features a central plate surrounded by a peripheral frame that is vertically spaced and parallel to the central plate. The frame has through openings formed within it, allowing for practical application in packaging semiconductor chips mounted to substrates. This inventive approach enhances functionality and protection for integrated circuits, demonstrating Franiatte's commitment to advancing technology.
Career Highlights
Olivier Franiatte works at STMicroelectronics, a leading global semiconductor company, in Grenoble. His role at such a prestigious institution highlights his importance in the field and his dedication to innovation in semiconductor packaging. Throughout his career, he has consistently pursued advancements that contribute to better electronic components.
Collaborations
Franiatte has collaborated closely with Richard Rembert, his coworker at STMicroelectronics. Together, they work on innovative projects that push the boundaries of semiconductor technology and integrated circuit packaging, combining their expertise to enhance the industry's offerings.
Conclusion
Olivier Franiatte exemplifies the spirit of innovation in the realm of integrated circuits. With his two patents, he continues to pave the way for new advancements in semiconductor packaging. His work at STMicroelectronics, alongside collaborations with dedicated professionals like Richard Rembert, ensures that the evolution of technology remains dynamic and forward-thinking.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
