The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2021
Filed:
Aug. 26, 2019
Applicant:
Stmicroelectronics (Grenoble 2) Sas, Grenoble, FR;
Inventors:
Olivier Franiatte, Grenoble, FR;
Richard Rembert, Quaix en Chartreuse, FR;
Assignee:
STMICROELECTRONICS (GRENOBLE 2) SAS, Grenoble, FR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01); H01L 21/60 (2006.01); H01L 21/603 (2006.01);
U.S. Cl.
CPC ...
H01L 23/04 (2013.01); H01L 21/56 (2013.01); H01L 23/49816 (2013.01); H01L 23/5385 (2013.01); H01L 2021/603 (2013.01); H01L 2021/60022 (2013.01);
Abstract
A cover for an integrated circuit package includes a central plate and a peripheral frame surrounding the central plate. The peripheral frame is vertically spaced from and parallel to the central plate. The peripheral frame includes through openings formed therein. The cover can be used to package a semiconductor chip that is mounted to a substrate.