Company Filing History:
Years Active: 2015-2024
Title: Oliver Ache: Innovator in Metrology Technology
Introduction
Oliver Ache is a notable inventor based in Leun, Germany. He has made significant contributions to the field of metrology, particularly in the measurement of overlay and substrate structures. With a total of 4 patents to his name, Ache continues to push the boundaries of innovation in his area of expertise.
Latest Patents
Ache's latest patents include a "Target and algorithm to measure overlay by modeling back scattering electrons on overlapping structures." This patent describes an overlay target that features a grating-over-grating structure, which includes a bottom grating structure placed on a specimen and a top grating structure positioned above it. The overlay target is designed with specific calibration and overlay scan locations to enhance measurement accuracy. Another significant patent is the "Method for measuring positions of structures on a substrate and computer program product for determining positions of structures on a substrate." This method improves throughput by utilizing a model to calculate the real grid of positions of structures on a substrate, even when there is a temperature mismatch between the substrate and the metrology machine stage.
Career Highlights
Throughout his career, Oliver Ache has worked with prominent companies in the industry, including KLA-Tencor Corporation and KLA Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in metrology technology.
Collaborations
Ache has collaborated with notable professionals in his field, including Frank Laske and Stefan Eyring. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.
Conclusion
Oliver Ache's contributions to metrology through his innovative patents and collaborations highlight his role as a leading inventor in the field. His work continues to influence the industry and pave the way for future advancements.