OhSug Kim

Title: OhSug Kim: Innovator in Integrated Circuit Technology

Introduction

OhSug Kim is a prominent inventor based in Anyang-si, South Korea. He has made significant contributions to the field of integrated circuit technology, holding a total of 5 patents. His work focuses on innovative methods and systems that enhance the performance and efficiency of electronic devices.

Latest Patents

Among his latest patents is the "Stacked Integrated Circuit Package-in-Package System and Method of Manufacture Thereof." This patent describes a method for manufacturing a stacked integrated circuit package that involves forming a substrate with a top contact, mounting a first device over the substrate, and stacking a second device in an offset configuration. The connections between the terminals and the top contact are crucial for the functionality of the system. Another notable patent is the "Integrated Circuit Package with Top Pad," which outlines a system that includes a bottom pad with a bottom tie bar, an integrated circuit die, and a top pad with a top tie bar. This design ensures that the top tie bar is exposed on the side of the encapsulant, enhancing the package's performance.

Career Highlights

OhSug Kim is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the field of integrated circuits. His expertise and dedication to advancing technology have made him a valuable asset to his company and the industry as a whole.

Collaborations

Throughout his career, OhSug has collaborated with talented individuals such as Jong-Woo Ha and Jong Wook Ju. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

OhSug Kim's contributions to integrated circuit technology are noteworthy and impactful. His innovative patents and collaborative efforts continue to shape the future of electronic devices. His work exemplifies the spirit of innovation that drives the industry forward.