Redwood City, CA, United States of America

O Samuel Nakagawa

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Tela Innovations, Inc.. Active years: 2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: O Samuel Nakagawa. Retrieved from https://idiyas.com/inventor/o-samuel-nakagawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 2 

Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2010

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2 patents (USPTO):Explore Patents

Title: **O Samuel Nakagawa: Innovator in Integrated Circuit Technology**

Introduction

O Samuel Nakagawa is a notable inventor based in Redwood City, California, known for his contributions to the field of integrated circuits. With a portfolio of two unique patents, Nakagawa has made significant strides in improving the designs and functionalities of electronic components. His innovative work primarily focuses on enhancing the performance and efficiency of integrated circuit interconnect layers.

Latest Patents

Nakagawa's latest patents showcase his expertise in semiconductor technology. The first patent, titled "Arrangement of fill unit elements in an integrated circuit interconnect layer," describes an integrated circuit that features a metal interconnect layer along with a conductive line. This invention defines a 'keep out' distance between the conductive line and a boundary, where a set of first fill elements is uniformly arranged outside of this distance. Moreover, a set of second fill elements, strategically placed further out from the conductive line, is arranged in a pattern with some elements intentionally omitted to enhance performance.

His second patent, "Layout description having enhanced fill annotation," involves a computer-readable media hosting a layout description of electric circuitry. This invention includes a detailed description of prospective fill units alongside characteristic data, which notes effects on the electrical characteristics of adjacent circuitry. In this case, the embodiment may elucidate the impact on timing and capacitance characteristics, and concerns regarding the thickness of nearby connective elements.

Career Highlights

Samuel Nakagawa's work at Tela Innovations, Inc. positions him as an integral player in the technology landscape. His innovative approach to integrated circuits reflects his commitment to advancing electronic design methodologies. Nakagawa’s patents are pivotal in creating more efficient electronic devices, contributing to ongoing advancements in the tech industry.

Collaborations

Throughout his career, Nakagawa has worked closely with fellow innovators, Andrew B. Kahng and Pakman Wong. Their collaborative efforts have helped in pushing the boundaries of semiconductor technology, fostering an environment of shared knowledge and creativity that leads to groundbreaking inventions in electronic design.

Conclusion

O Samuel Nakagawa continues to be a driving force in the field of integrated circuits, with his patents playing a crucial role in defining future innovations. His work not only exemplifies the spirit of invention but also showcases the importance of collaboration in fostering advancements in technology. Through his endeavors at Tela Innovations, Inc., Nakagawa is set to make further impactful contributions to electronics and integrated circuit design.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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