Location History:
- Cheongwon-gun, KR (2017)
- Chungcheongbuk-do, KR (2018 - 2019)
Company Filing History:
Years Active: 2017-2019
Title: O-Chung Kwon: Innovator in Flexible Printed Circuit Board Technology
Introduction
O-Chung Kwon is a notable inventor based in Chungcheongbuk-do, South Korea. He has made significant contributions to the field of flexible printed circuit boards, holding a total of 3 patents. His innovative methods have enhanced the manufacturing processes and operational reliability of these essential components in modern electronics.
Latest Patents
Kwon's latest patents include a method for manufacturing flexible printed circuit boards and the flexible printed circuit boards manufactured thereby. The first patent outlines a method that involves preliminarily thermally deforming a substrate through heating, forming a circuit pattern with a conductive paste, and firing the circuit pattern. This process ensures dimensional stability during firing and prevents deterioration of adhesion between the circuit pattern and the substrate. The second patent describes a flexible printed circuit board that includes a substrate, a circuit pattern, and a protective coating layer. This design improves the attachment of the circuit pattern to the substrate and prevents damage due to bending or warping.
Career Highlights
O-Chung Kwon is currently associated with Amogreentech Co., Ltd., where he continues to innovate in the field of flexible electronics. His work has been instrumental in advancing the technology used in various electronic devices, making them more reliable and efficient.
Collaborations
Kwon has collaborated with notable colleagues such as Jeong-Sang Yu and Jae-Sic Kim. Their combined expertise has contributed to the successful development of innovative solutions in the field of flexible printed circuit boards.
Conclusion
O-Chung Kwon's contributions to the field of flexible printed circuit boards demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the challenges in manufacturing and the need for reliable electronic components.