The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2017

Filed:

Dec. 31, 2013
Applicant:

Amogreentech Co., Ltd., Gimpo-si, KR;

Inventors:

Jong-Soo Kim, Yongin-si, KR;

Kyung-Hoon Lee, Paju-si, KR;

Jeong-Sang Yu, Gunpo-si, KR;

O-Chung Kwon, Cheongwon-gun, KR;

Assignee:

AMOGREENTECH CO., LTD., Gimpo-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 3/20 (2006.01); H05K 1/09 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 3/207 (2013.01); H05K 1/028 (2013.01); H05K 1/0326 (2013.01); H05K 1/0346 (2013.01); H05K 1/092 (2013.01); H05K 1/118 (2013.01); H05K 1/0287 (2013.01); H05K 3/12 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/0154 (2013.01);
Abstract

The present invention relates to a method for manufacturing a flexible printed circuit board and a flexible printed circuit board manufactured by using the same. A circuit pattern is formed with a conductive paste on one surface of a base material, and the circuit pattern is sintered at a temperature of 290° C. to 420° C. to manufacture the flexible printed circuit board. As such, manufacturing costs can be reduced and productivity can be improved through a simple yet convenient process. Also, the circuit pattern is formed without a plating process, such that the problem of circuit pattern separation occurring during the plating process can be addressed and product reliability can be improved.


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