The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2018

Filed:

Apr. 30, 2014
Applicant:

Amogreentech Co., Ltd., Gimpo-si, Gyeonggi-do, KR;

Inventors:

Jongsoo Kim, Gyeonggi-do, KR;

Jeong-Sang Yu, Gyeonggi-do, KR;

O-Chung Kwon, Chungcheongbuk-do, KR;

Jae-Sic Kim, Chungcheongnam-do, KR;

Assignee:

Amogreentech Co., Ltd., Gimpo-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/36 (2006.01); H05K 3/28 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 3/361 (2013.01); H05K 1/028 (2013.01); H05K 1/0298 (2013.01); H05K 1/092 (2013.01); H05K 1/115 (2013.01); H05K 3/0011 (2013.01); H05K 3/10 (2013.01); H05K 3/285 (2013.01); H05K 3/46 (2013.01); H05K 3/4664 (2013.01); H05K 3/4676 (2013.01); H05K 1/0393 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0317 (2013.01); H05K 2203/0759 (2013.01);
Abstract

A flexible printed circuit board includes a substrate, a circuit pattern formed on the substrate, and a protective coating layer formed on the substrate by applying and curing a coating solution to cover and protect the circuit pattern. A method for manufacturing forming a circuit pattern on a substrate and forming a protective coating layer for covering and protecting the circuit pattern by applying a coating solution on the substrate. The circuit pattern may be securely attached to the substrate, and damage and deformation of the circuit pattern due to repeated bending or warping of the substrate may be prevented, ultimately improving operational reliability.


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