Osaka, Japan

Noriki Hayashi

This inventor holds 27 USPTO granted patents and 1 published patent application, plus 6 CIPO patents and 1 EPO patent, primarily in Superconducting Materials. Top assignees: Sumitomo Electric Industries, Limited, The Tokyo Electric Power Company, Incorporated, Autonetworks Technologies, Limited. Active years: 1990-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Noriki Hayashi. Retrieved from https://idiyas.com/inventor/noriki-hayashi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 27 

% Patents Active = 85.2


 

Average Co-Inventor Count = 4.1

ph-index = 8

Forward Citations = 424(Granted Patents)


Company Filing History:


Years Active: 1990-2013

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Areas of Expertise:
Conductive Paste
Printed Wiring Board
Oxide Superconducting Films
Superconducting Circuit
Thin Film
Laminated Superconductor
Metallic Porous Body
Laser Deposition
Superconducting Wire
Superconducting Ceramics
Bulk Body
In-Situ Laser Ablation
27 patents (USPTO):Explore Patents

Title: Innovations of Noriki Hayashi in Conductive Paste Technology

Introduction

Noriki Hayashi, an accomplished inventor based in Osaka, Japan, holds an impressive portfolio of 27 patents. His work primarily focuses on advanced conductive paste technologies that have significantly enhanced the performance of printed wiring boards. Through his innovative approaches, he has made notable contributions to the fields of electronics and materials science.

Latest Patents

Hayashi's latest patents include "Conductive paste and multilayer printed wiring board using the same" and "Conductive paste and method for manufacturing multilayer printed wiring board using the same." The first patent introduces a conductive paste that comprises flake conductive fillers, specifically designed for high electrical conductivity and fill ratio in via holes. The innovative paste features metal particles with a silver-copper alloy surface layer, ensuring high reliability of connection in multilayer printed wiring boards.

The second patent details a conductive paste produced by kneading conductive particles into an epoxy resin, designed to maintain connection resistance stability even under severe environmental conditions like high temperature and humidity. This formulation emphasizes the balance of conductive particle content and the properties of the resin, central to the method for manufacturing multilayer printed wiring boards.

Career Highlights

Throughout his career, Noriki Hayashi has been associated with prominent companies in the industry, including Sumitomo Electric Industries, Limited and The Tokyo Electric Power Company, Incorporated. His professional journey reflects a commitment to innovation and excellence in the field of electrical engineering, particularly in developing materials that improve electronic device performance.

Collaborations

Hayashi has collaborated with esteemed colleagues such as Satoshi Takano and Noriyuki Yoshida. These partnerships have contributed to the successful development of his patented technologies, facilitating significant advancements in their respective areas of expertise.

Conclusion

Noriki Hayashi's contributions to conductive paste technology exemplify the importance of innovation in the advancement of electronic materials. With a strong foundation in both research and practical applications, he continues to play a pivotal role in enhancing the reliability and functionality of multilayer printed wiring boards, pushing the boundaries of what is possible in electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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