The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2012
Filed:
Oct. 25, 2007
Noriki Hayashi, Osaka, JP;
Yoshio Oka, Osaka, JP;
Masahiko Kanda, Osaka, JP;
Narito Yagi, Osaka, JP;
Kenji Miyazaki, Osaka, JP;
Kyouichirou Nakatsugi, Osaka, JP;
Noriki Hayashi, Osaka, JP;
Yoshio Oka, Osaka, JP;
Masahiko Kanda, Osaka, JP;
Narito Yagi, Osaka, JP;
Kenji Miyazaki, Osaka, JP;
Kyouichirou Nakatsugi, Osaka, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Abstract
A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 μm or less and the maximum particle diameter of which is 15 μm or less. Another printed wiring board and a method for manufacturing the same is characterized in that the surface of a conductor wiring fabricated using a conductive paste containing metal particles M and a binder B at a volume ratio of M/B of 1/1 to 1.9/1 is etched, a plating coating is formed on the surface.