Norihito Masuda

Title: Norihito Masuda: Innovator in Microelectronic Packaging

Introduction

Norihito Masuda is a prominent inventor based in Kanagawa, Japan. He has made significant contributions to the field of microelectronics, particularly in the area of packaging technologies. His innovative work has led to the development of advanced apparatuses that enhance the efficiency and functionality of microelectronic devices.

Latest Patents

Masuda holds a patent for a groundbreaking invention titled "Package-on-package assembly with wire bonds to encapsulation surface." This patent describes an apparatus related to microelectronic packaging. In this invention, a substrate features first contacts on its upper surface, while a microelectronic die has second contacts on its upper surface facing the substrate. The design includes wire bonds that connect these contacts, with a portion of the wire bonds bent to align with a dielectric layer above the substrate. This innovative approach improves the overall performance and reliability of microelectronic packages.

Career Highlights

Masuda is currently associated with Adeia Semiconductor Solutions LLC, where he continues to push the boundaries of microelectronic packaging technology. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and reliable for various applications.

Collaborations

Throughout his career, Masuda has collaborated with notable colleagues, including Hiroaki Sato and Teck-Gyu Kang. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas in the field of microelectronics.

Conclusion

Norihito Masuda's contributions to microelectronic packaging exemplify the spirit of innovation in technology. His patent and ongoing work at Adeia Semiconductor Solutions LLC highlight his commitment to advancing the field. His collaborations with esteemed colleagues further enhance the impact of his inventions.