Tokyo, Japan

Norihisa Akamatsu

This inventor holds 1 USPTO granted patent. Top assignee: Yuasa System Co., Ltd.. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Norihisa Akamatsu. Retrieved from https://idiyas.com/inventor/norihisa-akamatsu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Norihisa Akamatsu: Innovator in Deformation Testing Technology

Introduction

Norihisa Akamatsu is a prominent inventor based in Tokyo, Japan. He is known for his innovative contributions to the field of deformation testing technology. His work focuses on enhancing the safety and reliability of materials under stress.

Latest Patents

Akamatsu holds a patent for a deformation testing apparatus. This apparatus is designed to detect signs of breakage in a specimen before an actual break occurs. The technology involves multiple deformation cycles and includes an image capturing means, reference data storing means, and change detection means. This invention significantly improves the ability to monitor material integrity during testing.

Career Highlights

Akamatsu is associated with Yuasa System Co., Ltd., where he applies his expertise in developing advanced testing solutions. His work has contributed to the company's reputation for innovation in material testing technologies.

Collaborations

Akamatsu collaborates with talented colleagues, including Ryo Taguchi and Atsushi Shishido. Together, they work on various projects that push the boundaries of testing technology.

Conclusion

Norihisa Akamatsu's contributions to deformation testing technology exemplify his commitment to innovation and safety in material science. His patent and collaborative efforts continue to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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