This inventor holds 2 USPTO granted patents. Top assignees: Fry Metals, Inc., Other. Active years: 1987-1995.
Company Filing History:
Years Active: 1987-1995
Title: Norbert J Socolowski: Innovator in Thermoelectric Technology
Introduction
Norbert J Socolowski is a notable inventor based in Denville, NJ (US), recognized for his contributions to thermoelectric technology. He holds 2 patents that showcase his innovative approach to solving challenges in thermal cycling and soldering processes.
Latest Patents
One of Socolowski's latest patents is a thermoelectric cooler, which is a thermoelectric heat pump designed to withstand thermal stresses during cycling between cold and hot temperatures. This invention features improved joints between thermoelements and electrical conductors that significantly reduce fractures during thermal cycling. The joints utilize a specialized solder composition, including tin-silver-indium and tin-silver-cadmium, which enhances durability. Additionally, a robust nickel diffusion barrier is incorporated to further prevent joint fractures.
Another significant patent involves a solder preform that consists of a body of solder material with three legs extending from a central base. This preform is strategically placed between two solderable surfaces, heated to allow the solder to flow, and then cooled to create a solid bond. The design ensures that melting solder flows outward, effectively expelling gases from the bonding surfaces.
Career Highlights
Throughout his career, Socolowski has worked with various companies, including Fry Metals, Inc. His experience in the industry has contributed to his expertise in thermoelectric applications and soldering technologies.
Collaborations
Socolowski has collaborated with notable individuals such as Richard A Howarth and James L Bierschenk, further enhancing his innovative endeavors.
Conclusion
Norbert J Socolowski's work in thermoelectric technology and soldering processes exemplifies his commitment to innovation. His patents reflect a deep understanding of the challenges in thermal cycling and provide effective solutions that advance the field.