The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 1987
Filed:
Nov. 27, 1985
Applicant:
Inventor:
Norbert J Socolowski, Denville, NJ (US);
Assignee:
Fry Metals, Inc., Providence, RI (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
228246 ; 228 563 ;
Abstract
A solder preform comprises a body of solder material having at least three legs extending outwardly from a generally central base portion. In a method of use, the preform is disposed between two solderable surfaces (such as the metalized undersurface of a semiconductor die and a support surface therefor), heated above the solder melting point to cause the solder to flow between the surfaces, and then cooled to solidify the solder and effect the bond. The preform configuration is such that the melting solder flows generally outward from the central base portion to expel gases from between the surfaces to be bonded.