Nor Azhan Bin Mahmood

Title: Nor Azhan Bin Mahmood: Innovator in Electronic Device Packaging

Introduction

Nor Azhan Bin Mahmood is a notable inventor based in Selangor, Malaysia. He has made significant contributions to the field of electronic device packaging. His innovative approach has led to the development of a unique patent that addresses common challenges in the industry.

Latest Patents

Nor Azhan holds a patent for a "Package with Solder Mask." This electronic device package includes a solder mask designed to mitigate the leakage of resin or other adhesive materials from the region of a die and die bond pad onto other surfaces of the package. The design ensures that one or more wire bond pads of the package may be formed from the same conductive layer as the die bond pad. The solder mask is strategically positioned over portions of the conductive layer located directly between the wire bond pads and the die bond pad. Additionally, the solder mask may include portions disposed at one or more sides of the die bond pad and is formed over the package substrate prior to the attachment of the die to the die bond pad. This innovation enhances the reliability and efficiency of electronic devices.

Career Highlights

Nor Azhan is currently employed at NXP USA, Inc., where he continues to work on advancing technology in electronic packaging. His expertise and innovative mindset have made him a valuable asset to the company.

Collaborations

Nor Azhan collaborates with various professionals in his field, including his coworker Aznita Abdul Aziz, who brings her own expertise to their projects.

Conclusion

Nor Azhan Bin Mahmood is a pioneering inventor whose work in electronic device packaging has the potential to influence the industry significantly. His patent for a package with a solder mask exemplifies his commitment to innovation and excellence.