Tokyo, Japan

Nobuyuki Kanda

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Dai Nippon Printing. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Nobuyuki Kanda. Retrieved from https://idiyas.com/inventor/nobuyuki-kanda-s6cz87z2

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Nobuyuki Kanda and His Patent for a Foaming Adhesive Sheet.

Introduction

Nobuyuki Kanda is an inventor associated with Tokyo, Japan, and Dai Nippon Printing. His listed patent concerns a method for producing a product using a heat-activated adhesive composition.

Latest Patents

Kanda is credited with 1 patent: “Method for Producing Product, Adhesive Composition and Foaming Adhesive Sheet.” The invention describes placing an adhesive composition containing a thermosetting resin and a foaming agent between two members, then heating it to foam and cure the composition so the members adhere. The foaming agent is a thermally expandable microcapsule, and the method specifies properties for the composition and heating conditions.

Career Highlights

Kanda’s listed patent reflects work on adhesive materials and manufacturing processes. The disclosed method combines heat-induced foaming and curing to bond two members.

Collaborations

Kanda’s listed coworkers include Kentaro Hoshi and Izumi Hasegawa. The available information does not specify their roles in the patent or their working relationship with Kanda.

Conclusion

Nobuyuki Kanda is associated with Dai Nippon Printing and a patented approach to producing bonded products with a foaming adhesive composition.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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