The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
May. 12, 2023
Dai Nippon Printing Co., Ltd., Tokyo-to, JP;
Kentaro Hoshi, Tokyo-to, JP;
Izumi Hasegawa, Tokyo-to, JP;
Shinya Shimada, Tokyo-to, JP;
Junko Kodani, Tokyo-to, JP;
Nobuyuki Kanda, Tokyo-to, JP;
DAI NIPPON PRINTING CO., LTD., Tokyo, JP;
Abstract
A method for producing a product, the method including: a placing step of placing an adhesive composition, including a thermosetting resin and a foaming agent, between a first member and a second member; and an adhering step of adhering the first member and the second member by foaming and curing the adhesive composition by heating, wherein the foaming agent is a thermally expandable microcapsule; the adhesive composition has predetermined properties; and the adhesive composition is heated under predetermined heating conditions in the adhering step.