This inventor holds 3 USPTO granted patents. Top assignee: Mitsubishi Denki Kabushiki Kaisha. Active years: 2007-2010.
Company Filing History:
Years Active: 2007-2010
Title: Nobuhito Funakoshi: Innovator in Semiconductor Technology
Introduction
Nobuhito Funakoshi is a prominent inventor based in Fukuoka, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on methods for producing semiconductor devices, showcasing his expertise and innovative spirit.
Latest Patents
Funakoshi's latest patents include a method for producing semiconductor devices and the semiconductor devices themselves. The method involves several intricate steps, including preparing frames with die pads, using an insulation resin sheet, and employing a resin-sealing metal mold. This process ensures that power chips are effectively molded with sealing resin, enhancing the performance and reliability of semiconductor devices. The semiconductor device features power chips mounted on die pads, with a resin sheet that provides superior thermal conductivity compared to the mold resin.
Career Highlights
Nobuhito Funakoshi is associated with Mitsubishi Denki Kabushiki Kaisha, a leading company in the electronics and semiconductor industry. His work has been instrumental in advancing semiconductor manufacturing techniques, contributing to the efficiency and effectiveness of modern electronic devices.
Collaborations
Throughout his career, Funakoshi has collaborated with notable colleagues, including Kenichi Hayashi and Hisashi Kawafuji. These partnerships have fostered innovation and have played a crucial role in the development of new technologies in the semiconductor field.
Conclusion
Nobuhito Funakoshi's contributions to semiconductor technology are noteworthy, with his innovative methods and patents paving the way for advancements in the industry. His work continues to influence the development of efficient and reliable semiconductor devices.