The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2010
Filed:
Sep. 22, 2004
Kenichi Hayashi, Tokyo, JP;
Hisashi Kawafuji, Fukuoka, JP;
Tatsuyuki Takeshita, Fukuoka, JP;
Nobuhito Funakoshi, Fukuoka, JP;
Hiroyuki Ozaki, Tokyo, JP;
Kazuhiro Tada, Tokyo, JP;
Kenichi Hayashi, Tokyo, JP;
Hisashi Kawafuji, Fukuoka, JP;
Tatsuyuki Takeshita, Fukuoka, JP;
Nobuhito Funakoshi, Fukuoka, JP;
Hiroyuki Ozaki, Tokyo, JP;
Kazuhiro Tada, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Chiyoda-Ku, Tokyo, JP;
Abstract
A semiconductor device in which chips are resin-molded, including: frames having front and back surfaces and die pads; power chips mounted on the surfaces of the die pads; an insulation resin sheet having a first and a second surfaces which are opposed against each other, the resin sheet being disposed such that the back surfaces of the die pads contact the first surface of the resin sheet; and a mold resin applied on the first surface of the resin sheet so as to seal up the power chips. The thermal conductivity of the resin sheet is larger than that of the mold resin.