Nobuhiro Furudate

Title: **The Innovative Contributions of Nobuhiro Furudate**

Introduction

Nobuhiro Furudate, hailing from Iwate, Japan, is a notable inventor recognized for his significant contributions to semiconductor technology. With a total of two patents to his name, Furudate has focused on improving the design and functionality of electronic parts through innovative bending methods.

Latest Patents

Furudate's most recent patents are pivotal in the semiconductor industry. The first, titled "Method of bending outer leads of a semiconductor device," outlines a procedure where outer leads, arranged horizontally, are bent at their roots either upward or downward before being shaped into a final configuration. This method aims to enhance the efficiency of lead formation.

The second patent, "Lead forming for electronic parts having gull wing type outer leads," introduces a lead forming machine that employs a bending die and stripper with a pair of faced projections. This machine improves the coplanarity and bending accuracy of gull wing type outer leads, commonly found in resin molded semiconductor devices and quad flat packages. This innovative approach involves a detailed process using bending punches to achieve both primary and secondary lead forming while ensuring precision and quality.

Career Highlights

Furudate is affiliated with Kabushiki Kaisha Toshiba, a leading player in the technology sector. Through his work at Toshiba, he has been able to blend his inventive spirit with practical applications in semiconductor technology, advancing the field significantly.

Collaborations

Throughout his career, Furudate has collaborated with talented colleagues, including Minoru Togashi and Mitsuo Mori. These collaborations have helped foster an environment of creativity and innovation, leading to advancements that benefit the semiconductor industry.

Conclusion

Nobuhiro Furudate's contributions to semiconductor technology through his patents highlight his role as a forward-thinking inventor. His innovative methods for lead forming not only improve the manufacturing process but also set new standards for quality in electronic components. As he continues to collaborate with esteemed colleagues at Toshiba, the future looks promising for further advancements in semiconductor technology.