Kabushiki Kaisha Toshiba

Nobuhiro Furudate

Minoru Togashi

Mitsuo Mori

Katsuyoshi Inoue

A method of bending outer leads of a semiconductor device, wherein the outer leads arranged substantially horizontally are preparatorily bent upward or downward from their roots, and thereafter bent into a predetermined configuration, thereby to obtain final outer leads.

Method of bending outer leads of a semiconductor device

For improving both coplanarity and bending accuracy of gull wing type outer leads of electronic parts such as resin molded semiconductor devices, quad flat packages, etc., a lead forming machine is used which incudes a bending die and a stripper which have a pair of faced projections at both sides thereof, and bending punches vertically moving through perforations of the stripper. An electronic part with gull wing type outer leads is disposed between the bending die and the stripper in such a manner that the outer leads extend horizontally from the projections of the bending die. In this case, both sides of outer leads are placed on projections of the bending die without clamping them with the faced projections of the bending die and the stripper. The bending punches are depressed through perforations of the stripper to perform primary lead forming for the outer leads. Thereafter, the bending punches are further depressed to carry out secondary lead forming for the outer leads, while clamping flat portions of outer leads with the faced projections.

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Iwate, Japan

Nobuhiro Furudate