Company Filing History:
Years Active: 2013
Title: Innovations of Nishant Khanduja in Nanoscale Circuit Interconnects
Introduction
Nishant Khanduja is an accomplished inventor based in Boston, MA. He has made significant contributions to the field of microelectronics through his innovative work on nanoscale circuit interconnects. His research focuses on the assembly of nanoelements to create advanced circuit interconnects for microelectronic devices.
Latest Patents
Khanduja holds a patent for a "Three dimensional nanoscale circuit interconnect and method of assembly by dielectrophoresis." This invention involves an assembly of nanoelements that forms a three-dimensional nanoscale circuit interconnect. The process utilizes dielectrophoresis, applying an electrical field across a gap between vertically displaced non-coplanar microelectrodes in the presence of a liquid suspension of nanoelements. This method allows for the formation of a nanoelement bridge connecting the microelectrodes. The assembly can be performed at room temperature and is compatible with conventional semiconductor fabrication, achieving a high yield. The current-voltage curves from the nanoelement bridge indicate functionality with a resistance of −40 ohms for gold nanoparticles. This method is particularly suitable for creating high-density three-dimensional circuit interconnects and vertically integrated nanosensors.
Career Highlights
Khanduja is affiliated with Northeastern University, where he continues to advance his research in microelectronics. His work has garnered attention for its potential applications in the development of nanoscale devices and systems.
Collaborations
Khanduja has collaborated with notable colleagues, including Ahmed Busnaina and Mehmet Remzi Dokmeci, contributing to the advancement of research in the field of nanoscale technologies.
Conclusion
Nishant Khanduja's innovative work in the field of nanoscale circuit interconnects showcases his expertise and commitment to advancing microelectronic technologies. His contributions are paving the way for future developments in this critical area of research.