This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2013.
Company Filing History:
Years Active: 2013
Title: Nisha Anathakrishan: Innovator in Underfill Formulation
Introduction
Nisha Anathakrishan is a prominent inventor based in Chandler, AZ (US). She has made significant contributions to the field of materials science, particularly in the development of underfill formulations used in electronic packaging.
Latest Patents
Nisha holds a patent for an innovative underfill formulation and method aimed at increasing the adhesion properties of the material. The patent describes an underfill formulation that includes a solvent, a plurality of amphiphilic block copolymers in the solvent, and an adhesion promoter also present in the solvent. The formulation is designed to enhance the performance of electronic components by improving adhesion through the formation of micelles, which consist of a core and a shell. This innovative approach has the potential to advance the reliability of electronic devices.
Career Highlights
Nisha Anathakrishan is currently employed at Intel Corporation, where she applies her expertise in materials science to develop cutting-edge technologies. Her work has been instrumental in enhancing the performance and durability of electronic components.
Collaborations
Nisha collaborates with talented colleagues, including Linda A Shekhawat and Gregory S Constable, who contribute to her innovative projects and research initiatives.
Conclusion
Nisha Anathakrishan is a trailblazer in the field of underfill formulations, with her patent showcasing her innovative approach to improving adhesion properties in electronic packaging. Her contributions at Intel Corporation highlight her commitment to advancing technology in the industry.