Hersbruck, Germany

Nils Bossemeyer


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2002

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1 patent (USPTO):Explore Patents

Introduction

Nils Bossemeyer is an inventive force located in Hersbruck, Germany. He has made significant contributions to the field of electronic device packaging, with a unique patent that underscores his creativity and technical expertise.

Latest Patents

Nils holds a patent for an "Electronic device package and method." This innovation features an electronic package that includes a semiconductor device, a two-layer printed circuit substrate, and leads for providing external connections for the package assembly. The design includes an electrical conducting surface structure on the first layer, while the second layer contains a recess to accommodate the device. In this flip-chip arrangement, the frontside of the device is electrically coupled to the conducting structure, ensuring efficient functionality. The backside of the device is coplanar to the surface of the second layer, with leads partially overlaying the layer's surface, enhancing connectivity and performance.

Career Highlights

Nils is associated with Motorola Corporation, a prominent company recognized for its innovation in telecommunications and electronics. His role at Motorola not only allows him to work on groundbreaking technologies but also places him among the ranks of leading inventors in the industry. With his patent, he showcases his ability to blend engineering skill with practical application.

Collaborations

Throughout his career, Nils has worked alongside talented colleagues such as Will Specks and Mervi Paulasto. Their collaborative efforts contribute to the innovative atmosphere at Motorola, where teamwork is essential in bringing cutting-edge solutions to market.

Conclusion

Nils Bossemeyer exemplifies the spirit of innovation within the electronics industry through his inventive solutions and collaborative efforts. His patent for an electronic device package not only pushes the boundaries of technology but also highlights the importance of structural design in enhancing product functionality. As he continues to work at Motorola Corporation, the impact of his contributions is likely to resonate within the field for years to come.

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