The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2002
Filed:
Jan. 24, 2000
Applicant:
Inventors:
Assignee:
Motorola Inc., Schaumburg, IL (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/302 ; H01L 2/348 ; H05K 1/16 ;
U.S. Cl.
CPC ...
H01L 2/302 ; H01L 2/348 ; H05K 1/16 ;
Abstract
An electronic package ( ) has a semiconductor device ( ), a two-layer ( ) printed circuit substrate ( ), and a lead ( ) for providing external connections for the package assembly ( ). The first layer ( ) has an electrical conducting surface structure ( ); and the second layer ( ) has a recess ( ) to receive the device ( ). The device frontside ( ) is electrically coupled to the conducting surface structure ( ) of the first layer ( ) in a flip-chip arrangement. The backside ( ) of the device ( ) is coplanar to the surface ( ) of the second layer ( ). The lead ( ) at least partially overlays the surface ( ) of the second layer ( ).