Motorola Corporation

Nils Bossemeyer

Will Specks

Mervi Paulasto

An electronic package ( ) has a semiconductor device ( ), a two-layer ( ) printed circuit substrate ( ), and a lead ( ) for providing external connections for the package assembly ( ). The first layer ( ) has an electrical conducting surface structure ( ); and the second layer ( ) has a recess ( ) to receive the device ( ). The device frontside ( ) is electrically coupled to the conducting surface structure ( ) of the first layer ( ) in a flip-chip arrangement. The backside ( ) of the device ( ) is coplanar to the surface ( ) of the second layer ( ). The lead ( ) at least partially overlays the surface ( ) of the second layer ( ).

Growing community of inventors

Hersbruck, Germany

Nils Bossemeyer